For citations:

Stepanenko D.A., Eromin E.S. Ensuring Uniform Material Removal with Magnetic Abrasive Finishing of Semiconductor Wafers by Mode Control of Machining Parameters. Science & Technique. 2023;22(6):477-486. (In Russ.) https://doi.org/10.21122/2227-1031-2023-22-6-477-486